The 880 series is specifically designed for TV and commercial display manufacturing, focusing on pure COF (Chip On Film) bonding processes. The complete line includes a terminal cleaning machine, COF bonding machine, COF punching equipment, AOI Particle and Displacement Detection Machine, PCB bonding machine, and a three-in-one dispensing machine, catering to bonding needs for products ranging from 14″ to 27″.
| Process Flow | EC+COF+AOI+FOB+DISP |
| Size | 14″~27″ |
| Key Accuracy | ACF Attachment: X-axis ±0.15mm, Y-axis ±0.1mmCOF Punching: X/Y-axis ±0.05mmCOF Bonding: X/Y-axis ±5μmPCB Bonding: X-axis ±25μm, Y-axis ±30μmDispensing Accuracy: X/Y-axis ±0.1mmAlignment Accuracy: ±0.1mmBacklight Assembly Accuracy: ±0.1mm (Y) / +30μm |
| Tact time | With 6 COFs on one side and 1 PCB: TT ≤ 16 seconds |
| Equipment utilization | ≥98% |
| Optional Features | The equipment can be equipped with CIM functionality.PCB loading occurs at the side of the equipment, and ACF attachment is done with a moving head, making the device more compact.FOB bonding can optionally include AOI offset detection.The dispensing machine comes with built-in silver paste AOI.The dispensing machine is standard with domestic spray valves, with an option to choose specified brand spray valves. |
| Solution↓ | Solution1CY880 series | Solution2CY900 series | |
| Size | 14″~27″ | 17″~37″ | |
| Bonding | LD | / | / |
| EC | CYCF880 | CYQ900 | |
| COG | / | / | |
| COF | CYCF880 | CYCF900 | |
| AOI | CYAI880 | CYAI900 | |
| FOB | CYFB880 | CYFB900 | |
| DISP | CYD880 | CYD900 | |
| Backlight Assembly | CYB900 27″ | CYB900 37″ | |
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