The 6000 series is specifically tailored for high-speed automatic bonding solutions in the 20″ to 60″ commercial display and TV segment, as well as automotive long-bar displays. It supports multi-sided, multi-COF bonding with full automation for loading and unloading throughout the line. Automated handover between robotic arms at each workstation enables unmanned operation.
Process Flow | EC+COF+A01+Buffer+DISP+FOB |
Size | 20″~60″ |
Key Accuracy | ACF Attachment: X/+0.15mm, Y/+0.1mm COF Punching: X/Y±0.05mm COF Bonding: X/Y±5μm PCB Bonding: X/±25μm, Y/±30μm Dispensing Accuracy: X/Y±0.1mm |
Tact time | S Side 6 COFs + 1 PCB: TT ≤ 12s S Side 6 COFs + G Side 3 COFs + 2 PCBs: TT ≤ 14s |
Equipment Efficiency (OEE) | ≥98% |
Optional Features | Equipment can interface with CIM functionality; Single-side bonding of 1-2 PCBs; FOB Bonding AOI Misalignment Detection Feature; Dispensing machine equipped with standard domestic needle valve, optional upgrade to specified brand spray valve |
Solution↓ | Solution CY6000 series | |
Size | 20″~60′ | |
Bonding | LD | / |
| EC | CYQ6000 |
| COF Pre-bonding | CYOB6000 |
| COF Main Bonding | CYBD6000 |
| Buffer | CYBF6000 |
| FOB | CYFB6000 |
| AOI | CYAI6000 |
DISP | CYD6000 | |
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