This fully automated line equipment is designed for the FPC bonding and dispensing of ultrasonic biometric fingerprint modules. It automates the entire production process, including Sensor/FPC automatic feeding, terminal cleaning, ACF adhesion , FPC pre-pressing, FPC one-stage main pressing/second-stage main pressing, AOI, dispensing, UV curing, and Tray unloading. It offers two process flows based on customer needs: ACF attached to the chip or ACF attached to the FPC.
Solution1↓ | CYFR1000 | Solution2↓ | CYFR2000 |
Size | 0.3″~2.8″ | Size | 0.3″~2.8″ |
FPC-LD | / | FPC-LD | CYFR2001 |
Chip LD + EC | CYFR1001 | Chip LD | CYFR2002 |
FOG+AOI | CYFR1002 | EC+FOG | CYFR2003 |
DISP + Material Receiving | CYFR1003 | DISP + Material Receiving | CYFR2004 |
Inspect the actual operation of the factory, in-depth understanding and verification of product use effect.
Through field visits, in-depth understanding of the factory operation process and product production effect.
We providing comprehensive sample testing services for our clients, ensuring that your products meet industry standards. Whether it’s raw materials or finished products, we have the professional equipment and team to help you ensure the quality of every sample.
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Huide International Building, Fuyong Street, Bao’an District, Shenzhen
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