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Advanced Flexible Display Bonding and Dispensing Line Solutions

Advanced Flexible Display Bonding and Dispensing Production Line

The CY3600 series is tailored for flexible OLED display products, incorporating COG/FOG, COF/FOF, and COP/FOP bonding processes into a unified solution. The CY3500 series is designed for rigid OLED displays, supporting COG/FOG and COF/FOF bonding processes with compatible equipment.

Key Features

Advanced Flexible Display Bonding and Dispensing Processing Equipment

  • Enables switching between diverse product types without machine changeovers for IC/COF bonding, aligning with the mainstream bonding techniques in future display modules. The system operates with a dual-handling and dual-bonding setup, achieving a cycle time of 3.5 seconds.
  • The comprehensive line includes loading machines, cleaning machines, COF/COG/COPbonding machine, a combined COF punching and IC loading machine, FOF/FOG/FOP bonding machine, automatic FPC loaders, flipping machines, particle indentation AOI, impedance testers, T-FOG and T-FOF bonding stations.
  • Designed with material input ports for manual loading, ensuring flexibility in production.
  • Seamless integration of all equipment along the line ensures smooth operation from start to finish, enhancing efficiency and adaptability to different production needs.
Parameter Introduction
Process FlowLD+EC+COG(COF&COP)+FOG(FOF&FOP)+RT+AI+D+TF+TFF
Size1″~8″
Key AccuracyWater Drop Angle Accuracy: Hard Screen ≤20°
Cleaning Effect Distance from CF Edge: ≥0.2mm
ACF Attachment Precision: X: ±0.1mm, Y: ±0.1mm
COG Bonding Precision: X: ±4μm, Y: ±4μm
COF Bonding Precision: X: +4μm, Y: ±5μm
COP Bonding Precision: X: ±5μm, Y: ±5μm
COF Punching Precision: ±0.05mm
FOG Bonding Precision: X: ±12μm, Y: ±12μm
FOF Bonding Precision: X: ±15μm, Y: ±15μm
FOP Bonding Precision: X: ±15μm, Y: ±15μm
Tact timeTT≤3.5S
Equipment utilization≥98%
Optional FeaturesPlasma and Velvet Cloth Cleaning
On Cell Cleaning
T-FOG Double-Sided Bonding
U-Plasma Brand designation
Sulution layout diagram

Advanced Flexible Display Bonding and Dispensing equipment layout

Advanced Flexible Display Bonding and Dispensing Line Solutions

Advanced Flexible Display Bonding and Dispensing layout matching solutions​

Solution↓Solution1CY3600 seriesSolution2CY3500 series
Size1″~8″1″~8″
BondingLDCYLG3600CYLG3500
 ECCYQ3600CYQ3500
 COGCYAC3600CYAC3500
 COF  
 COP /
 COF PunchingCYPH3600ACYPH3500
 IC Feeding  
 FOGCYAF3600CYAF3500
 FOF  
 POF /
RTCYRT3600CYRT3500
AOICYA13600CYD3600
DispensingCYA13500CYD3500
T-FOGCYTF3600CYTF3500
T-FOFCYTFF350CYFF350

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